Microassembly of 3-D MEMS structures utilizing a MEMS microgripper with a robotic manipulator

This paper describes the process of bonding a MEMS (Micro-ElectroMechanical System) microgripper to the distal end of a robotic manipulator arm using a molten solder bonding technique. This task is part of ongoing work which involves the development of a general microassembly workstation. The goal of this workstation is to construct 3-D microstructures from MEMS subcomponents. The microgrippers bonded using the method described here are 1.5 mm by 0.6 mm in size. The methodology behind the solder bonding approach is presented, along with the design of a custom soldering device referred to as the contact head. The contact head is used as the interface between the robotic manipulator and the microgripper. Experimental results are given in a qualitative discussion. An explanation of the bonding procedure using automated calibration is described, along with pictures from the associated microscopy system, and some scanning electron microscope images.